Paris has always been known as a city where creative ideas come to life, making it the perfect setting for one of Europe's most influential AI events. This year, RAISE Summit brought together AI leaders, innovators, and decision-makers from around the globe to explore what's next for artificial intelligence. For 5C, the week marked several exciting milestones—from exhibiting at the summit for the first time, to announcing a strategic collaboration with AMD, and to taking the Master Stage for a fireside chat on why the future of AI infrastructure depends on an optimized ecosystem engineered to work in synergy.
It was a busy (and very hot!) week in Paris, but one thing became abundantly clear: as AI continues to evolve at an unprecedented pace, the infrastructure powering it must evolve just as quickly.
Making Our RAISE Summit Debut
This year's RAISE Summit marked 5C's first time exhibiting, giving our team the opportunity to showcase how purpose-built AI infrastructure is enabling large-scale AI deployments for today's workloads while preparing organizations for tomorrow's AI demands.
Throughout the week, we met with customers, technology partners, investors, and industry leaders who are all tackling similar challenges. While conversations around GPUs and AI models remain important, the industry's focus has clearly expanded to the infrastructure required to support them. Topics such as power availability, liquid cooling, high-performance networking, deployment timelines, and campus-scale design dominated discussions across the exhibition floor.
Those conversations reinforced what we're seeing across the market: AI is no longer constrained by advances in compute alone. Delivering the power, cooling, networking, and operational infrastructure required to deploy AI at scale has become just as critical as the hardware itself. At 5C, this integrated approach is foundational to how we design, build and operate AI factories—engineering every layer of the ecosystem to work in synergy, enabling organizations to deploy AI faster, operate more efficiently, and scale with confidence.
Announcing Our Strategic Collaboration with AMD
One of the biggest highlights of the week was announcing our strategic collaboration with AMD to advance the next generation of gigascale AI campuses.
As AI models continue to grow in complexity and compute requirements, the infrastructure supporting them must be designed differently than it was only a few years ago. Rather than treating compute, power, cooling, networking, and software as independent layers, the industry is increasingly embracing a holistic approach where every component is designed together from the start. That philosophy sits at the heart of our collaboration with AMD.
By combining AMD's AI technology roadmap with 5C's expertise in designing, building, and operating purpose-built AI infrastructure, we're helping develop campuses capable of supporting large-scale AI training, inference, and emerging agentic AI workloads. Initial deployments are already underway in Ohio and Memphis, laying the foundation for infrastructure designed not only for today's hardware, but to accelerate the development of AMD Helios-ready gigascale AI campuses built for the next generation of AI.
Future-proofing has become one of the defining challenges of modern AI infrastructure. Every new hardware generation introduces higher power densities, evolving cooling technologies, and increasingly demanding networking requirements. Infrastructure can no longer be designed for a single deployment cycle. Instead, AI campuses must be built with the flexibility to evolve alongside the rapid pace of innovation.
More than a technology announcement, this collaboration reflects a shared commitment to designing AI infrastructure holistically—from chip to campus—ensuring every layer works together efficiently to deliver scalable, high-performance AI environments.
You can read more about the announcement in our press release.
Fireside Chat with AMD on the Master Stage
Building on the momentum of the partnership announcement, 5C (David Bitton & David Dubrovsky) and AMD (Andrew Dieckmann) took the Master Stage for a fireside chat moderated by Bloomberg News (Rachel Metz) to explore one of the industry's most critical questions: What will it take to power the next generation of AI?
The discussion explored how rapidly advancing AI is fundamentally reshaping the way data centers are designed, built, and operated. Traditional approaches are no longer sufficient when infrastructure must support successive hardware generations, increasing rack densities, and constantly evolving cooling and networking technologies. Instead, AI campuses must be designed as integrated systems, with infrastructure providers and technology companies collaborating from the earliest planning stages.
One of the strongest themes throughout the discussion was the importance of co-design. Close collaboration between chip manufacturers and infrastructure providers makes it possible to align infrastructure planning with future hardware roadmaps rather than reacting once new systems arrive. This approach enables optimization across compute, cooling, networking, storage, software, and operations, creating AI-ready facilities that are both efficient and scalable.
The panel also explored one of the industry's most significant challenges: power. While securing access to electricity often captures the headlines, delivering entitled power to AI campuses—with the required infrastructure, permits, and realistic timelines—is frequently the greater obstacle. Successful site selection now depends on balancing power availability, network connectivity, political stability, long-term operating costs, and community support.
Equally important is engaging local communities early in the development process. Addressing concerns around water usage, noise, visual impact, and electricity demand through open communication helps ensure AI campuses become long-term contributors to regional economic growth rather than sources of disruption.
Another fascinating topic focused on how AI companies are using AI to accelerate their own innovation. Both AMD and 5C are increasingly applying AI across engineering, software development, validation, observability, and operations. These capabilities are helping accelerate product development while improving the performance and reliability of the infrastructure that powers the next generation of AI.
Looking ahead, the panel agreed that AI infrastructure will continue to evolve in multiple directions. Gigawatt-scale campuses will support the world's largest foundation models, while regional deployments and edge infrastructure will bring AI closer to enterprises and communities around the globe. Supporting this diverse ecosystem will require infrastructure that is flexible, scalable, and built through trusted partnerships that can adapt alongside AI's accelerating pace.
If you missed the session, you can watch the full fireside chat below.
Looking Back on an Incredible Week
As we reflect on an unforgettable week in Paris, one message stands above all else: the future of AI infrastructure will be built through collaboration.
From exhibiting at RAISE Summit for the first time, to announcing our strategic collaboration with AMD, sharing the Master Stage, and connecting with customers, partners, and innovators throughout the week, every experience reinforced the value of bringing together expertise from across the AI ecosystem. The future of AI is being built today, and 5C is proud to be helping design the infrastructure for the age of intelligence.
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